Showing 1 - 6 of 6, total 1 pages [First] [Previous] [Next] [Last] |
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1 | | | bga board
Specification: BGA Board
Detail: FR4 TG130 2 layers 96*60mm Solder mask:Green Silkscreen:White
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2 | | | std-technology rigid board
Specification: 8 layer
Detail: Std-Technology Rigid Board sample Layer Count: 8L ENIG
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3 | | | 10 layer board
Specification: 10 layer
Detail: 10 layer ENIG Impedance control Resin filled in hole Intensive IC
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4 | | | 8 layer board
Specification: 8 layer
Detail: 8 layer ENIG black solder
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5 | | | rigid-flex board
Specification: 2 layer
Detail: 2 layer Rigid-flex pcb with impedance control
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6 | | | aluminum board
Specification: 1 layer
Detail: 1 layer,Aluminum Board,1.0 MM OSP, Mine line/width 6 mil
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